{"id":8115059097780,"title":"Syringe Soldering Paste, Soldering Paste Sn42Bi58, Lead-Free Low Temperature 138°C, 40g | Gruiqrd Lead Free Flux Solder Flux Tin Paste for BGA LED SMD SMT Solder (1.41oz)","handle":"syringe-soldering-paste-soldering-paste-sn42bi58-lead-free-low-temperature-138-c-40g-gruiqrd-lead-free-flux-solder-flux-tin-paste-for-bga-led-smd-smt-solder-1-41oz","description":"\u003ch3\u003eSyringe Soldering Paste, Soldering Paste Sn42Bi58, Lead-Free Low Temperature 138°C, 40g | Gruiqrd Lead Free Flux Solder Flux Tin Paste for BGA LED SMD SMT Solder (1.41oz)\u003c\/h3\u003e\n\u003cp id=\"b\"\u003e\u003c\/p\u003e \n\n\u003ch3\u003eProduct Features\u003c\/h3\u003e\n \u003cul class=\"a\"\u003e\n \u003cli\u003eGruiqrd Solder paste content: alloy tin 42% Bi58%, flux content: 10.5%. Total weight: 50 g, net weight of the paste: 40 g\u003c\/li\u003e\n \u003cli\u003eHigh solderability: A powerful thixotropic agent is added to the solder to make the solder paste highly active. During the soldering process, the solder is significantly moistened, reducing the phenomenon of missoldering\u003c\/li\u003e\n \u003cli\u003eLead-free solder paste: no cleaning, strong viscosity, bright welding point. Medium temperature soldering paste with flux, melting point: 138C (280F)\u003c\/li\u003e\n \u003cli\u003ePRODUCT ADVANTAGES Push design for more smooth flowing, no waste when welding. Piston injection needle features: reflow soldering does not produce tin beads and tin bridges\u003c\/li\u003e\n \u003cli\u003eApplications Low temperature tin is widely used in the repair of electronic products. Low temperature tin is mainly used for items that cannot withstand the high temperature of the device. 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Total weight: 50 g, net weight of the paste: 40 g\u003c\/li\u003e\n \u003cli\u003eHigh solderability: A powerful thixotropic agent is added to the solder to make the solder paste highly active. During the soldering process, the solder is significantly moistened, reducing the phenomenon of missoldering\u003c\/li\u003e\n \u003cli\u003eLead-free solder paste: no cleaning, strong viscosity, bright welding point. Medium temperature soldering paste with flux, melting point: 138C (280F)\u003c\/li\u003e\n \u003cli\u003ePRODUCT ADVANTAGES Push design for more smooth flowing, no waste when welding. Piston injection needle features: reflow soldering does not produce tin beads and tin bridges\u003c\/li\u003e\n \u003cli\u003eApplications Low temperature tin is widely used in the repair of electronic products. Low temperature tin is mainly used for items that cannot withstand the high temperature of the device. For example, electronic components that do not withstand high temperatures, LED soldering, PCB BGA CPU SMD maintenance\u003c\/li\u003e\n \u003c\/ul\u003e"}
Syringe Soldering Paste, Soldering Paste Sn42Bi58, Lead-Free Low Temperature 138°C, 40g | Gruiqrd Lead Free Flux Solder Flux Tin Paste for BGA LED SMD SMT Solder (1.41oz)
Syringe Soldering Paste, Soldering Paste Sn42Bi58, Lead-Free Low Temperature 138°C, 40g | Gruiqrd Lead Free Flux Solder Flux Tin Paste for BGA LED SMD SMT Solder (1.41oz)
Product Features
- Gruiqrd Solder paste content: alloy tin 42% Bi58%, flux content: 10.5%. Total weight: 50 g, net weight of the paste: 40 g
- High solderability: A powerful thixotropic agent is added to the solder to make the solder paste highly active. During the soldering process, the solder is significantly moistened, reducing the phenomenon of missoldering
- Lead-free solder paste: no cleaning, strong viscosity, bright welding point. Medium temperature soldering paste with flux, melting point: 138C (280F)
- PRODUCT ADVANTAGES Push design for more smooth flowing, no waste when welding. Piston injection needle features: reflow soldering does not produce tin beads and tin bridges
- Applications Low temperature tin is widely used in the repair of electronic products. Low temperature tin is mainly used for items that cannot withstand the high temperature of the device. For example, electronic components that do not withstand high temperatures, LED soldering, PCB BGA CPU SMD maintenance