{"id":8115342934196,"title":"No Clean Solder Paste Flux (3.5oz\/100g), BGA Solder Flux Paste, Electronic Flux Pastes for BGA\/IC\/CPU\/PCB\/SMD Solder","handle":"no-clean-lotpaste-flussmittel-3-5oz-100g-bga-lot-flussmittelpaste-elektronik-flussmittel-pasten-fur-bga-ic-cpu-pcb-smd-lotzinn","description":"\u003ch3\u003eNo Clean Solder Paste Flux (3.5oz\/100g), BGA Solder Flux Paste, Electronic Flux Pastes for BGA\/IC\/CPU\/PCB\/SMD Solder\u003c\/h3\u003e \u003cp id=\"b\"\u003eNo Clean Solder Paste Flux (3.5oz\/100g), BGA Solder Flux Paste, Electronic Flux Pastes for BGA\/IC\/CPU\/PCB\/SMD Solder\u003c\/p\u003e \u003ch3\u003eProduct Features\u003c\/h3\u003e \u003cul class=\"a\"\u003e \u003cli\u003eIndustrial-grade solder flux. Advantages: Lead-free, no-clean, halogen-free, acid-free, non-corrosive, high bond strength, good immersion, good insulation, very little residue, easy to tin, helps solder firmly, makes soldering more fluid, slightly yellow solder flux paste.\u003c\/li\u003e \u003cli\u003eSolder paste flux, made from no acid, lead-free, no-clean, non-resistive, non-conductive, non-corrosive for electronics Components, ideal for soldering ICs and BGAs, strong deoxidation properties for wires, ideal for wiring. Applications of the soldering flux paste: mobile phone repair, computer and digital service industry, high-precision SMT soldering of printed circuit boards, BGA welding process, maintenance drag soldering, BGA tinning, maintenance desoldering, soldering of electronic components, mobile phone maintenance, mobile phone chip maintenance, LED lighting, household appliance maintenance, etc. High surface insulation resistance after the residue has solidified. 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Advantages: Lead-free, no-clean, halogen-free, acid-free, non-corrosive, high bond strength, good immersion, good insulation, very little residue, easy to tin, helps solder firmly, makes soldering more fluid, slightly yellow solder flux paste.\u003c\/li\u003e \u003cli\u003eSolder paste flux, made from no acid, lead-free, no-clean, non-resistive, non-conductive, non-corrosive for electronics Components, ideal for soldering ICs and BGAs, strong deoxidation properties for wires, ideal for wiring. Applications of the soldering flux paste: mobile phone repair, computer and digital service industry, high-precision SMT soldering of printed circuit boards, BGA welding process, maintenance drag soldering, BGA tinning, maintenance desoldering, soldering of electronic components, mobile phone maintenance, mobile phone chip maintenance, LED lighting, household appliance maintenance, etc. High surface insulation resistance after the residue has solidified. Suitable for welding on instruments, counters, copper, tin and other metals, PCB, SMD, SMT patch panels, telephone and appliance repair.\u003c\/li\u003e\n\u003c\/ul\u003e"}

No Clean Solder Paste Flux (3.5oz/100g), BGA Solder Flux Paste, Electronic Flux Pastes for BGA/IC/CPU/PCB/SMD Solder

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No Clean Solder Paste Flux (3.5oz/100g), BGA Solder Flux Paste, Electronic Flux Pastes for BGA/IC/CPU/PCB/SMD Solder

No Clean Solder Paste Flux (3.5oz/100g), BGA Solder Flux Paste, Electronic Flux Pastes for BGA/IC/CPU/PCB/SMD Solder

Product Features

  • Industrial-grade solder flux. Advantages: Lead-free, no-clean, halogen-free, acid-free, non-corrosive, high bond strength, good immersion, good insulation, very little residue, easy to tin, helps solder firmly, makes soldering more fluid, slightly yellow solder flux paste.
  • Solder paste flux, made from no acid, lead-free, no-clean, non-resistive, non-conductive, non-corrosive for electronics Components, ideal for soldering ICs and BGAs, strong deoxidation properties for wires, ideal for wiring. Applications of the soldering flux paste: mobile phone repair, computer and digital service industry, high-precision SMT soldering of printed circuit boards, BGA welding process, maintenance drag soldering, BGA tinning, maintenance desoldering, soldering of electronic components, mobile phone maintenance, mobile phone chip maintenance, LED lighting, household appliance maintenance, etc. High surface insulation resistance after the residue has solidified. Suitable for welding on instruments, counters, copper, tin and other metals, PCB, SMD, SMT patch panels, telephone and appliance repair.