{"id":8115320455348,"title":"Low Temperature Solder 138°C Lead-Free Solder (Sn42 Bi58 \/ 0.8mm, 50g) Sn42 Bi58 \/ 0.8 Mm, 50G","handle":"low-temperature-solder-138-c-lead-free-solder-sn42-bi58-0-8mm-50g-sn42-bi58-0-8-mm-50-g","description":"\u003ch3\u003eLow Temperature Solder 138°C Lead-Free Solder (Sn42 Bi58 \/ 0.8mm, 50g)\u003c\/h3\u003e \u003cp id=\"b\"\u003e\u003c\/p\u003e \u003ch3\u003eProduct Features\u003c\/h3\u003e \u003cul class=\"a\"\u003e \u003cli\u003eMelting point 138 C: content of tin in solder is up to 42%, and the electrical conductivity and thermal conductivity are better. It can be dissolved at a temperature of 138 C. 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It can be dissolved at a temperature of 138 C. Compared to other styles on the market, our melting point is lower and the welding speed is faster to help you get away from the anxious goods\u003c\/li\u003e \u003cli\u003eSolder wire: product composition ratio: Sn42%, Bi58%, weight 54g, diameter of tin wire 0.8 mm\u003c\/li\u003e \u003cli\u003eProfessional: strong electrical conductivity, low working temperature, suitable for welding thermal components and thermal overload protection such as mobile phone motherboards and other high-precision and demanding welding work such as iPhone The high activity of the product makes the performance of the product more stable, not only the welding speed is high, but also reduces the residue of impurities\u003c\/li\u003e \u003c\/ul\u003e"}

Low Temperature Solder 138°C Lead-Free Solder (Sn42 Bi58 / 0.8mm, 50g) Sn42 Bi58 / 0.8 Mm, 50G

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Low Temperature Solder 138°C Lead-Free Solder (Sn42 Bi58 / 0.8mm, 50g)

Product Features

  • Melting point 138 C: content of tin in solder is up to 42%, and the electrical conductivity and thermal conductivity are better. It can be dissolved at a temperature of 138 C. Compared to other styles on the market, our melting point is lower and the welding speed is faster to help you get away from the anxious goods
  • Solder wire: product composition ratio: Sn42%, Bi58%, weight 54g, diameter of tin wire 0.8 mm
  • Professional: strong electrical conductivity, low working temperature, suitable for welding thermal components and thermal overload protection such as mobile phone motherboards and other high-precision and demanding welding work such as iPhone The high activity of the product makes the performance of the product more stable, not only the welding speed is high, but also reduces the residue of impurities