{"id":8115442843828,"title":"Galunoptimal Solder Tin ISO Core Soldering Wire Clear Sn100Ni+ Sn99.3CuNiGe 0.5 mm on 100 g Spool Made by Felder GmbH in Germany","handle":"galunoptimal-solder-tin-iso-core-soldering-wire-clear-sn100ni-sn99-3cunige-0-5-mm-on-100-g-spool-made-by-felder-gmbh-in-germany","description":"\u003ch3\u003eGalunoptimal Solder Tin ISO Core Soldering Wire Clear Sn100Ni+ Sn99.3CuNiGe 0.5 mm on 100 g Spool Made by Felder GmbH in Germany\u003c\/h3\u003e\n\u003cp id=\"b\"\u003eThe GALLUNOPTIMAL by FELDER ISO-Core Sn100Ni+ soldering wire is a high-\nquality, lead-free solder wire, ideal for precise hand soldering work in\nelectronics and electrical engineering. With a low halogen content of \u0026lt;0.15%\nand a melting temperature of 227°C, it enables reliable, long-lasting solder\nconnections. The micro alloy of tin, copper, nickel and germanium reduces\noxidation at the soldering tip and ensures high mechanical stability.\nCompliant with DIN EN ISO 9454-1, 1223, it meets strict quality requirements.\nThe 2.2% flux filling Clear according to REL1 standard (Rosin, Low Activity,\nHalogenated) ensures even wetting of the solder joints and facilitates clean,\nprecise soldering results. Thanks to the low halogen content, there is no risk\nof corrosion, so cleaning the solder joint is usually not necessary. Areas of\napplication: - fine soldering work on printed circuit boards, SMD components\nand electronic components - versatile for work in electronics and electrical\nengineering - reliable repairs to boards, assemblies and aged solder joints -\nprecise solder connections for model making, sensor technology and industrial\napplications - optimal wetting for low-oxidation, clean solder joints Box\ncontents: 1x GOCL050100Ni+, 0.5. 1000 mm diameter g spool GALLUNOPTIMAL by\nFELDER ISO-Core Sn100Ni+ (Sn99.25Cu0.7Ni0.05)\u003c\/p\u003e \n\n\u003ch3\u003eProduct Features\u003c\/h3\u003e\n \u003cul class=\"a\"\u003e\n \u003cli\u003eThis lead-free solder is ideal for electronics, whether for THD or SMD components\u003c\/li\u003e\n \u003cli\u003eIts eutectic melting range is 227C, which ensures a low working temperature and reduces the thermal load on the components\u003c\/li\u003e\n \u003cli\u003eThis is a clear wire, which means cleaning the solder joints is not necessary, the flux residues are crystal clear\u003c\/li\u003e\n \u003cli\u003eThe flux content is 2.2% REL1 (free from rosin \/ with halogen) which allows optimal wetting of the solder joint\u003c\/li\u003e\n \u003cli\u003eAlloy: Sn 99, 3CuNiGe\/Box contents: 100 g spool with a wire diameter of 0.5 mm\u003c\/li\u003e\n \u003c\/ul\u003e","published_at":"2026-09-02T10:24:30+10:00","created_at":"2026-09-02T03:30:36+10:00","vendor":"FELDER","type":"Solder","tags":["industrial_DE_Aug2026"],"price":16100,"price_min":16100,"price_max":16100,"available":true,"price_varies":false,"compare_at_price":null,"compare_at_price_min":0,"compare_at_price_max":0,"compare_at_price_varies":false,"variants":[{"id":44375219962036,"title":"Default Title","option1":"Default Title","option2":null,"option3":null,"sku":"de-B07XZC539V","requires_shipping":true,"taxable":true,"featured_image":null,"available":true,"name":"Galunoptimal Solder Tin ISO Core Soldering Wire Clear Sn100Ni+ Sn99.3CuNiGe 0.5 mm on 100 g Spool Made by Felder GmbH in 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Solder Tin ISO Core Soldering Wire Clear Sn100Ni+ Sn99.3CuNiGe 0.5 mm on 100 g Spool Made by Felder GmbH in Germany\u003c\/h3\u003e\n\u003cp id=\"b\"\u003eThe GALLUNOPTIMAL by FELDER ISO-Core Sn100Ni+ soldering wire is a high-\nquality, lead-free solder wire, ideal for precise hand soldering work in\nelectronics and electrical engineering. With a low halogen content of \u0026lt;0.15%\nand a melting temperature of 227°C, it enables reliable, long-lasting solder\nconnections. The micro alloy of tin, copper, nickel and germanium reduces\noxidation at the soldering tip and ensures high mechanical stability.\nCompliant with DIN EN ISO 9454-1, 1223, it meets strict quality requirements.\nThe 2.2% flux filling Clear according to REL1 standard (Rosin, Low Activity,\nHalogenated) ensures even wetting of the solder joints and facilitates clean,\nprecise soldering results. Thanks to the low halogen content, there is no risk\nof corrosion, so cleaning the solder joint is usually not necessary. Areas of\napplication: - fine soldering work on printed circuit boards, SMD components\nand electronic components - versatile for work in electronics and electrical\nengineering - reliable repairs to boards, assemblies and aged solder joints -\nprecise solder connections for model making, sensor technology and industrial\napplications - optimal wetting for low-oxidation, clean solder joints Box\ncontents: 1x GOCL050100Ni+, 0.5. 1000 mm diameter g spool GALLUNOPTIMAL by\nFELDER ISO-Core Sn100Ni+ (Sn99.25Cu0.7Ni0.05)\u003c\/p\u003e \n\n\u003ch3\u003eProduct Features\u003c\/h3\u003e\n \u003cul class=\"a\"\u003e\n \u003cli\u003eThis lead-free solder is ideal for electronics, whether for THD or SMD components\u003c\/li\u003e\n \u003cli\u003eIts eutectic melting range is 227C, which ensures a low working temperature and reduces the thermal load on the components\u003c\/li\u003e\n \u003cli\u003eThis is a clear wire, which means cleaning the solder joints is not necessary, the flux residues are crystal clear\u003c\/li\u003e\n \u003cli\u003eThe flux content is 2.2% REL1 (free from rosin \/ with halogen) which allows optimal wetting of the solder joint\u003c\/li\u003e\n \u003cli\u003eAlloy: Sn 99, 3CuNiGe\/Box contents: 100 g spool with a wire diameter of 0.5 mm\u003c\/li\u003e\n \u003c\/ul\u003e"}