{"id":8115311247540,"title":"Desoldering Braid, 2.5 mm x 3.0 m, Copper Desoldering Wire, No-Clean Desoldering Wire, Copper Wire Desoldering Wick for Removing Solder and Disassembling Electrical Components, High Thermal","handle":"desoldering-braid-2-5-mm-x-3-0-m-copper-desoldering-wire-no-clean-desoldering-wire-copper-wire-desoldering-wick-for-removing-solder-and-disassembling-electrical-components-high-thermal","description":"\u003ch3\u003eDesoldering Braid, 2.5 mm x 3.0 m, Copper Desoldering Wire, No-Clean Desoldering Wire, Copper Wire Desoldering Wick for Removing Solder and Disassembling Electrical Components, High Thermal\u003c\/h3\u003e\n\u003cp id=\"b\"\u003eSpecification Size: 2.5 mm x 3 m. Product parameters: 1. Pure copper refined\nwith special chemicals to ensure good, fast and economical use. 2. For\nremoving tin to suck excess welding, oxidative corrosion resistance, thermal\nconductivity, tin effect are very good to vacuum tin clean. Key Features This\ntin suction tape uses a copper wire weaving process that absorbs fast thermal\nconductivity and fine fabric structure to quickly absorb melt welds, reduce\nresidue and improve welding and recovery efficiency. The low-residue design of\nthe product requires no additional cleaning and is suitable for a variety of\nwelding scenarios such as laboratory, school, home and industry as a practical\ntool for electronics manufacturing and circuit service. Intended use: with\ncopper wire and special chemical formulas precisely woven, non-halogen low\nresidues free clean tin suction tape clean welding plate necessary. Suitable\nfor all kinds of electronics, electrical appliances, precision instruments.\nCan quickly suck tin and suck large amounts of tin. Remove excess welding and\nmuch more. . Features of the product: tin suction wire should be used in\nwelding IC components and others in case of tin connection with pin, the tin\nglued to the pins can be removed. Do not ensure a short circuit between the\npins. In addition, when planting BGA components, it is necessary to use tin\nsuction wire to clean the welding plate of the BGA components, so that the\nsuccess rate of planting is greatly increased.\u003c\/p\u003e \n\n\u003ch3\u003eProduct Features\u003c\/h3\u003e\n \u003cul class=\"a\"\u003e\n \u003cli\u003eFast Thermal Conductivity The copper wire weaving process is combined with a flat fiber structure, which high thermal conductivity helps to quickly absorb excess welding materials and improve the efficiency and accuracy of the welding process.\u003c\/li\u003e\n \u003cli\u003eFine Woven Structure The product features a finely woven texture and even heat distribution, which quickly inhales the melted weld into the tin suction band, keeps the surface of the circuit board clean, and reduces sweat residue.\u003c\/li\u003e\n \u003cli\u003eCleaning: after use, only small amounts of non-conductive and non-corrosive residue, no additional cleaning steps required, save operating time and are suitable for fine electronic repair scenarios.\u003c\/li\u003e\n \u003cli\u003eWide Application Suitable for welding and repair in laboratories, schools, home and industrial environments, it is a practical tool for making electronics and repairing circuits.\u003c\/li\u003e\n \u003cli\u003eEASY OPERATION Welding material removal can be completed without complicated operations to reduce the risk of damage to circuit boards and components, suitable for troubleshooting small circuit boards and cleaning small parts.\u003c\/li\u003e\n \u003c\/ul\u003e","published_at":"2026-09-02T11:03:39+10:00","created_at":"2026-09-01T23:59:15+10:00","vendor":"NYVOR","type":"Wicks \u0026 Braids","tags":["industrial_DE_Aug2026"],"price":8500,"price_min":8500,"price_max":8500,"available":true,"price_varies":false,"compare_at_price":null,"compare_at_price_min":0,"compare_at_price_max":0,"compare_at_price_varies":false,"variants":[{"id":44375032103092,"title":"Default Title","option1":"Default 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Braid, 2.5 mm x 3.0 m, Copper Desoldering Wire, No-Clean Desoldering Wire, Copper Wire Desoldering Wick for Removing Solder and Disassembling Electrical Components, High Thermal\u003c\/h3\u003e\n\u003cp id=\"b\"\u003eSpecification Size: 2.5 mm x 3 m. Product parameters: 1. Pure copper refined\nwith special chemicals to ensure good, fast and economical use. 2. For\nremoving tin to suck excess welding, oxidative corrosion resistance, thermal\nconductivity, tin effect are very good to vacuum tin clean. Key Features This\ntin suction tape uses a copper wire weaving process that absorbs fast thermal\nconductivity and fine fabric structure to quickly absorb melt welds, reduce\nresidue and improve welding and recovery efficiency. The low-residue design of\nthe product requires no additional cleaning and is suitable for a variety of\nwelding scenarios such as laboratory, school, home and industry as a practical\ntool for electronics manufacturing and circuit service. Intended use: with\ncopper wire and special chemical formulas precisely woven, non-halogen low\nresidues free clean tin suction tape clean welding plate necessary. Suitable\nfor all kinds of electronics, electrical appliances, precision instruments.\nCan quickly suck tin and suck large amounts of tin. Remove excess welding and\nmuch more. . Features of the product: tin suction wire should be used in\nwelding IC components and others in case of tin connection with pin, the tin\nglued to the pins can be removed. Do not ensure a short circuit between the\npins. In addition, when planting BGA components, it is necessary to use tin\nsuction wire to clean the welding plate of the BGA components, so that the\nsuccess rate of planting is greatly increased.\u003c\/p\u003e \n\n\u003ch3\u003eProduct Features\u003c\/h3\u003e\n \u003cul class=\"a\"\u003e\n \u003cli\u003eFast Thermal Conductivity The copper wire weaving process is combined with a flat fiber structure, which high thermal conductivity helps to quickly absorb excess welding materials and improve the efficiency and accuracy of the welding process.\u003c\/li\u003e\n \u003cli\u003eFine Woven Structure The product features a finely woven texture and even heat distribution, which quickly inhales the melted weld into the tin suction band, keeps the surface of the circuit board clean, and reduces sweat residue.\u003c\/li\u003e\n \u003cli\u003eCleaning: after use, only small amounts of non-conductive and non-corrosive residue, no additional cleaning steps required, save operating time and are suitable for fine electronic repair scenarios.\u003c\/li\u003e\n \u003cli\u003eWide Application Suitable for welding and repair in laboratories, schools, home and industrial environments, it is a practical tool for making electronics and repairing circuits.\u003c\/li\u003e\n \u003cli\u003eEASY OPERATION Welding material removal can be completed without complicated operations to reduce the risk of damage to circuit boards and components, suitable for troubleshooting small circuit boards and cleaning small parts.\u003c\/li\u003e\n \u003c\/ul\u003e"}