BGS 74508 | Solder | Roll | Lead-Free | Diameter 1.5 mm | 10 g | For printed circuit boards | Sn99.3Cu0.7 | Melting point 217 - 227 °C | Good flow properties | High conductivity Solder, diameter 1.5 mm
BGS 74508 | Solder | Roll | Lead-Free | Diameter 1.5 mm | 10 g | For printed circuit boards | Sn99.3Cu0.7 | Melting point 217 - 227 °C | Good flow properties | High conductivity
Lead-free alloy. For processing printed circuit boards. Guarantees reliable solder connections With good flow properties and high conductivity. Construction: Sn99.3Cu0.7. Diameter: 1.5 mm. Density: 7.4 Melting point: 217°C - 227°C.
Product Features
- Lead-free alloy | for processing printed circuit boards
- Guarantees reliable solder connections
- With good flow properties and high conductivity
- Construction: Sn99.3Cu0.7
- Diameter: 1.5 mm | Density: 7.4 | Melting point: 217C - 227C