Aideepen Peltier TEC1-04902 Heatsink Module Pack of 5 | Peltier element 5V 2A 10W, semiconductor cooling elements electric for cooling heating, heat dissipation of mobile phones
Aideepen Peltier TEC1-04902 Heatsink Module Pack of 5 | Peltier element 5V 2A 10W, semiconductor cooling elements electric for cooling heating, heat dissipation of mobile phones
Product parameters: Model: TEC1-04902 Supply voltage: DC 5 V. Maximum temperature difference: 60°C Internal resistance of the conductor: 2.26 Ω. Current: 2A Power: 10W Temperature resistance: 180 °C. Connection cable length: L = 100 mm. Contact pressure: 2 kg. Storage conditions: -40 to 60 °C; 20 to 90% RH Dimensions: 20 x 20 x 4.0 mm. Features: 1. Semiconductor technology without moving parts for quiet and reliable operation. 2. High efficiency cooling with a maximum temperature difference of up to 60°C, suitable for various applications. 3. Extremely low power consumption, environmentally friendly and energy-saving with high safety. 4. Compact and lightweight, with dimensions of only 20 × 20 × 4.0 mm, easy to install. 5. Widely used in heat dissipation of electronic equipment, small cooling systems and other fields. Instructions for use: How is cooling achieved? Components required: semiconductor cooler + heat sink + thermal paste + thermal pad + power supply 1. Apply thermal paste to the cold side of the semiconductor cooler. 2. Mount the semiconductor cooler on the heat sink and place a thermal pad in between. 3. Connect DC; the cooling side starts to cool. Notes on the semiconductor cooler: 1. Ensure sufficient heat dissipation of the heat- generating side during operation. Never supply power without adequate cooling, as this can lead to damage. 2. Apply thermal paste to the heat sink before installation. Package includes: 5 x semiconductor coolers. 1 x user manual.
Product Features
- Product Parameters: Model: TEC1-04902; Supply Voltage: 5V DC; Current: 2A; Power: 10W; Dimensions: 20 x 20 x 4.0mm
- High efficiency cooling: Uses semiconductor technology without moving parts, ensuring quiet and reliable operation. The maximum temperature difference is 60C.
- Easy to use: 1. Apply thermal paste to the cooling surface of the semiconductor. 2. Mount the semiconductor cooling chip on the heat sink and place a thermal pad in between. 3. Direct current; cooling begins.
- Wide Applications Extremely low power consumption, environmentally friendly and energy saving, high safety. Ideal for heat dissipation in small electronic devices, small cooling systems, etc.
- Attention: A heat sink or water cooling system must be installed on the cooling surface, otherwise it will burn out. Apply thermal paste before installing the heat sink.