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Used for thermal management situations requiring superior\nbonding strengths and good thermal transfers. For example, it is used to as a\ndie-attach for electrical and electronics, increasing their long term\nreliability. It is great for heat sink bonding. It is also used as a high-\npowered LED adhesive that maximizes the lifetime of LEDs by dissipating their\nheat. . It has a convenient 1-to-1 ratio, a workable 45 minutes pot life, and\na moderate curing rate. It may achieve a minimal service cure in seven hours\nat room temperature. 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MG Chemicals - 8329TCM-6ML 8329TCM Thermally Conductive Adhesive, Medium Cure, 14 g, 2 Dispensers, 6 mL Kit,

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MG Chemicals - 8329TCM-6ML 8329TCM Thermally Conductive Adhesive, Medium Cure, 14 g, 2 Dispensers, 6 mL Kit,

The 8329TCM Medium Cure Thermal Conductive Adhesive is an electronically insulating epoxy that combines moderate curing rate and high thermal conductivity. Used for thermal management situations requiring superior bonding strengths and good thermal transfers. For example, it is used to as a die-attach for electrical and electronics, increasing their long term reliability. It is great for heat sink bonding. It is also used as a high- powered LED adhesive that maximizes the lifetime of LEDs by dissipating their heat. . It has a convenient 1-to-1 ratio, a workable 45 minutes pot life, and a moderate curing rate. It may achieve a minimal service cure in seven hours at room temperature. The cured adhesive bonds very well to most substrates used in electronic assemblies; and resists thermal and mechanical shocks.

Product Features

  • Thermal conductivity: 1.36 W/(mK)
  • Easy 1:1 mix ratio
  • Adheres to most electronic substrates
  • Stores and ships at slightly below room temperature - no freezing or dry ice required. Very long shelf life of at least two years - even when stored at room temperature
  • Strong water and chemical resistance to brine, acids, bases, and aliphatic hydrocarbons

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